Details

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LED Die Bonder - DB156

Features:

• Compatible with a wide range of package types.
• Lateral CCD monitoring for precise dispensing control.
• Customised optical communication TO-can die bonding function.
• Flexible configuration to meet customised functional requirements.

Specifications:

• Wafer Ring Size: 6”
• Chip Size: 6–40 mil
• Placement Accuracy: ±38 μm (X, Y), ±3° (θ)
• Work Table Size: 230 × 120 m